Axus Technology delivers advanced process development expertise, equipment, and service support for:
     -- CMP & Polishing
     -- Wafer Thinning and Grinding 
     -- Edge Grinding and Profline
     -- Substrate Cleaning Applications
     -- Wafer Bonding Applications.

Axus'​ customers range from leading-edge production semiconductor manufacturers through small development facilities.  We deliver surface processing solutions to a broad range of technologies, including semiconductor, MEMs device processing, device packaging, TSV/3D Integration, materials processing and development, as well as for virtually any application where material needs to be made flatter, smoother, or thinner.   

Axus Technology supports a global customer base with a high-quality customer support experience known for delivering high quality, and often highly customized, processes and equipment.   

The Axus Technology team works with a broad array of substrates and films, applying fundamental and novel process technologies into new product applications.

Semiconductor

Axus Technology

Dan Trojan

Grazyna Bendisz

Axus Technology

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Operations Team

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