BE Semiconductor Industries N.V. (Besi) is a holding company. The Company is engaged in the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries. It operates through three segments: Die Attach, Packaging and Plating. It develops assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a range of end user markets, including electronics, computer, automotive, industrial and solar energy. The Company offers products, such as Die attach equipment, which include single chip, multi-chip, multi module, flip chip, thermo-compression bonding (TCB) and enhanced wafer level ball grid array (eWLB) die bonding systems, and die sorting systems; Packaging equipment, which include wafer level molding and singulation systems, and Plating equipment, which include metal plating systems and related process chemicals.

Electronics

Marketing

BE Semiconductor Industries NV

Richard Blickman

Leon Verweijen

René Hendriks

J.K. Park

Henk-Jan Jonge Poerink

Bart Berenbak

Jeroen Kleijburg

Peter Wiedner

Christoph Scheiring

Ruurd Boomsma

Leadership Team

Operations and Financial Management

BE Semiconductor Industries NV

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Leadership Team

Operations and Financial Management

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