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FlipChip International, LLC

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FlipChip International is a world leading WLCSP bumping supplier, with wafer dicing and thinning capabilities, ASIC, ASPP and ASSP design, and a complete IC service from design to packaging.

Industries

Semiconductor

Headquarters

Phoenix, United States

Employees

501-1,000

Links

Org chart

BF
Bob Forcier
CEO

Bob Forcier

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TC
Tony Curtis
R D And Reliability Engineering Manager
DC
Dawn Cuevas
Human Resource Manager
Dejen Eshete
Director Of Quality, Reliability And Supply Chain Management
DL
David Lawhead
Engineer
DP
David Pigeon
Manufacturing Technician
GC
Gary Chapman
Associate Process Engineer
JH
Jeff Hicklin
Test Production Engineer
Jose Garcia
Equipment Technician
LS
Larry Shelby
Manufacturing Technichan
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Nova Sihatay
Process Technician
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Ray Lawrence
Process Engineer
RH
Rudycarrillo: Hotmail.com
Equiment Engeenir
SO
Steven Ostroski
Process Engineer
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Nang Long
Senior Accountant

Teams

DP
GC
+6

Engineering Team

9 members

EC
TC

Quality Assurance Team

3 members

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