Qingjun Qin

Qingjun Qin is an experienced engineering professional with a focus on chemical engineering and expertise in CMP (Chemical Mechanical Planarization) processes. Currently serving as a Member of Technical Staff at TDK/Headway Technologies, Inc. since June 2015, Qingjun Qin has developed strategies for optimizing wafer CMP processes, conducted root cause analyses, and implemented methodologies to enhance operational efficiency. Previous roles include Sr. Staff Engineer at Western Digital, where Qingjun Qin managed CMP processes and improved yield and cost, and Process Development Engineer III at Novellus Systems Inc., with significant contributions to CMP process development. Qingjun Qin holds a Ph.D. in Chemical Engineering from Clarkson University and advanced degrees from Tianjin University, demonstrating a strong academic background complemented by extensive industry experience.