Wei Zhou

Wei Zhou is a seasoned professional in the field of mechanical engineering with extensive experience in advanced packaging research and development. Currently serving as a Senior Member of the Technical Staff and Packaging R&D Lead at Micron Technology since June 2001, Wei Zhou has played a pivotal role in the Advanced Packaging R&D department after transferring to Micron HQ in Boise, ID, USA, in March 2016. Prior to this, Wei Zhou was a Senior Research Scholar at the National University of Singapore, focusing on advanced packaging thermal, moisture, delamination, and stress behaviors through modeling and experimentation. Beginning a career as a Civil Structure Engineer at Kepple Fels Singapore, Wei Zhou contributed to steel structure design and analysis for oil rig manufacturing. Wei Zhou holds a PhD in Mechanical Engineering from the National University of Singapore and both a B. Eng and M. Eng in Mechanical Engineering from Huazhong University of Science and Technology.