Keng Yuen Au

Keng Yuen Au is a seasoned professional in the semiconductor technology and research fields, currently serving as a Member of Technical Staff at Samsung Electronics since July 2024. Prior experience includes roles as Senior Engineer III at the Institute of Microelectronics, where expertise in semiconductor technology was developed, and R&D Engineer at Apple, focusing on research and development projects. Keng Yuen Au has also made significant contributions as a Senior Engineer II at the Institute of Microelectronics, leading process development for advanced packaging technologies, and as Principal Engineer at UTAC, driving TCB-NCP process capabilities and technology proliferation. Earlier experience includes the establishment of the first Flip Chip Mass Production Line at Infineon Technologies and pioneering work on various flip chip packaging technologies at Carsem. Keng Yuen Au holds a Bachelor of Science in Computer Engineering from the University of Oklahoma.