Mohammad Rafiee is a Microelectronic Packaging Design Engineer at Sanmina, specializing in semiconductor packaging design, testing, and reliability for various technologies including flip-chip and photonic integrated circuits. In addition to industry work, Mohammad serves as an Adjunct Professor at the University of Ottawa, teaching courses in advanced manufacturing and electronics packaging, blending theoretical concepts with practical insights from professional experience. Previous roles include Research Officer at the National Research Council Canada and Research Fellow at Polytechnique Montréal. Mohammad holds a Doctor of Philosophy (PhD) in Mechanical Engineering from the University of Ottawa.