Teng Chow Ooi

Teng Chow Ooi currently serves as a Senior Director for Advanced Packaging Program Management and Product Test Engineering at Intel Corporation, having been with the company since April 2016. Prior to Intel, Teng Chow Ooi held various roles at Altera from April 2003 to April 2016, including Senior Manager of Product Engineering, where responsibilities included managing production ramp processes and overseeing products that significantly contributed to the company's revenue. Additional roles at Altera encompassed IC Design Manager and IC Design Engineer, with a focus on transitioning designs from FPGA to ASIC, promoting company advantages to clients, and developing advanced memory and transceiver designs.