Adam Friedman-Selsley

Adam Friedman-Selsley is an experienced engineer specializing in semiconductor fabrication and process development, currently serving as a Wafer Fab Deposition Engineer IV at SRI since September 2024. Prior roles include Principal PVD Engineer at Menlo Micro, and Senior Principal Process Engineer Thin Films/Metals/RTA at NexGen Power Systems, where Adam played a crucial role in establishing a semiconductor fab for GaN power devices and developed innovative thin film solutions. Adam's background also encompasses teaching positions at WSWHE BOCES and various roles in process engineering at companies such as Crystal IS and GLOBALFOUNDRIES. Adam holds a Master of Science in Materials Engineering from Rensselaer Polytechnic Institute, an MBA from Penn State University, and a Bachelor of Science in Materials Engineering from Rensselaer Polytechnic Institute.