Sherwin Deng

Sherwin Deng is a seasoned engineer with extensive experience in the semiconductor industry, currently serving as a Field Application Engineer at Teradyne since August 2021, focusing on the design and implementation of tests for analog and digital integrated circuits. Previously, Sherwin held the position of Sr. Test Engineer at Microchip Technology, where responsibilities included leading the development of test solutions for Δ-Σ ADCs, designing test hardware, and analyzing characterization data. Additional experience includes roles at Microsemi, Essai, Inc., ProMatch, iSoftStone, SiTime, Maxim Integrated Products, Honeywell, and China Petroleum & Chemical Corporation, encompassing application engineering, product testing, project management, and business development. Academic qualifications include a Master of Arts from Fuller, a Master of Engineering in Electrical Engineering from Arizona State University, and a Bachelor's degree in Electrical Engineering from China Petroleum University.