Reid Wender

Reid Wender is an accomplished Vice President of Marketing and Technical Sales at Triad Semiconductor, where responsibilities include collaborating with engineers to facilitate the integration of innovative ideas into configurable mixed-signal ASICs since February 2005. Prior to this role, Wender held positions as Director of Applications Engineering at ASIC International, overseeing ASIC designs for various applications, and as VP of Engineering for the Semiconductor Division at Quvis, where development of a 3D Wavelet-based image CODEC was managed for the film industry. Wender also served as an Engineering Manager at Philips Consumer Electronics, bringing a wealth of experience in the semiconductor field, backed by a BS in Electrical Engineering from the University of Tennessee, Knoxville.