Ariya S.

Ariya S. is a seasoned engineering leader with over 17 years of experience in software and infrastructure engineering. Currently serving as the Senior Director of Engineering at Above Lending since May 2023, Ariya previously held the position of Director of Software Engineering at Amount from April 2019 to March 2023, where the roles of Senior Developer Manager and Developer Manager were also undertaken. Prior experience includes serving as Lead Software Engineer at Playboy Enterprises, Inc., and various engineering roles at Technologent and Siemens PLM Software, demonstrating a strong foundation in both implementation and infrastructure engineering. Ariya began the professional journey as a Principal Software Support Analyst at TechFlow, Inc. and holds a Bachelor of Science degree in Computer Science from the University of California, Riverside.