Yongfeng Bai

Yongfeng Bai is an experienced engineering professional with a strong background in mechanical and manufacturing engineering. Currently serving as a Senior Mechanical Engineer at Alpha Technologies since March 2020, Yongfeng leads mechanical design initiatives focused on customer needs and manufacturability enhancements. Previously, at Intel Semiconductor (Dalian) Ltd., Yongfeng held roles including Senior Process Engineer and Module Team Leader, overseeing module startup, process improvements, and project implementations aimed at safety and cost efficiency. Yongfeng’s career also includes positions as Mechanical Design Engineer at IC Equipment (Shanghai) Ltd. and Mechanical Design Engineer at Qinchuan Machinery Development Corp., Ltd., where significant contributions were made in semiconductor equipment design and component development. Yongfeng holds a Master's degree in Mechanical Engineering from Xi'an Jiaotong University and an additional Master's degree in Engineering Leadership in Advanced Material Manufacturing from The University of British Columbia.