Tee Kok Chen

Tee Kok Chen is a Manufacturing Process Engineer II at ASMPT Ltd since June 2023. Previously, Tee served as a Field Process Assistant Engineer at Lam Research from April 2021 to March 2023, leading the process transfer for key modules between Micron Boise Fab4 and Singapore Fab10. Before that, Tee held the position of Field Process Engineer I at G&B Pte Ltd from January 2017 to April 2021, providing support for plasma etch and deposition systems at Micron Semiconductor Fab10N/X/A and collaborating with account teams for equipment qualification and process integration. Tee holds a Bachelor Degree of Manufacturing Engineering with Honors specializing in Material Engineering from Universiti Teknikal Malaysia Melaka, obtained in 2016.