Sudip Chakraborty

Sudip Chakraborty is a seasoned technology professional with extensive experience in the financial services industry. Currently serving as a Senior Technical Lead in Clearance and Collateral Technology at BNY Mellon since January 2020, Sudip specializes in the design and development of collateral management workflows and is a Google Certified Professional Cloud Architect. Prior to this role, Sudip held various technical leadership positions at Citi, where responsibilities included overseeing operations and technology initiatives in the Cash Securities domain and migrating applications to a microservices architecture. Additional experience includes roles at Credit Suisse, Bank of America, Barclays Capital, Lehman Brothers, AIG, and TCS across technical lead and software architect roles. Sudip holds a Bachelor of Engineering degree in Electronics and Telecommunication from Gauhati University.