Eric Kuo is a Mechanical Engineer with extensive experience in thermal and mechanical engineering across several prominent companies. Currently employed at COFAN USA since April 2019, Eric previously held positions at AMD, where responsibilities included consulting OEM/ODM customers and performing engineering support in thermal solutions. Eric's background also includes work as a Thermal Engineer at Hewlett-Packard, where thermal modules for commercial products were designed, and as a Senior Thermal and Mechanical Engineer at AMD, focusing on thermal lab experiments and customer design reviews. Earlier experience includes managing a thermal and acoustic development department at MiTAC Inc. Eric holds a Master of Engineering in Automotive Engineering Technology from the University of Windsor, a Master’s degree in Mechanical Engineering from National Sun Yat-Sen University, and a Bachelor’s degree in Mechanical Engineering from Yuan-Ze University.
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