Mechanical Engineer, Electronics Packaging (entry Level)

Cornelis Networks is a technology leader delivering purpose-built, high-performance fabrics accelerating High Performance Computing, High Performance Data Analytics, and Artificial Intelligence workloads in the Cloud and in the Data Center.

The company’s products enable scientific, academic, governmental, and commercial customers to solve some of the world’s toughest challenges by efficiently focusing the computational power of many processing devices at scale on a single problem, simultaneously improving both result accuracy and time-to-solution for their most complex application workloads. Cornelis Networks delivers its end-to-end interconnect solutions worldwide through an established set of server OEM and channel partners.

We are seeking a talented and motivated Entry Level Mechanical Engineer to join our team, focusing on electronics packaging for High-Performance Computing (HPC) and Artificial Intelligence (AI) systems. This is an exciting opportunity to work with cutting-edge technologies and play a crucial role in designing innovative thermal and mechanical solutions for HPC/AI systems, ensuring optimal performance and reliability.

As an Entry Level Mechanical Engineer, you will collaborate with cross-functional teams, including electrical engineers, systems architects, and product designers, to develop and implement thermal management, structural integrity, and cooling solutions for high-power electronic systems.

Key Responsibilities:

• Mechanical Design & Analysis: Assist in designing, analyzing, and validating mechanical systems and components for HPC electronics packaging. Develop detailed 3D models and drawings using CAD software (SolidWorks, Creo, etc.). Perform structural and thermal simulations (FEA/CFD) to evaluate design feasibility, performance, and reliability.

• Thermal Management: Support designing and optimizing air and liquid cooling systems to manage heat dissipation in HPC environments. Work on innovative cooling solutions, including liquid cooling loops, heat sinks, and vapor chambers.

• Packaging & Integration: Collaborate on developing robust packaging solutions for electronic components, considering mechanical stresses, thermal cycling, and environmental conditions. Ensure mechanical designs comply with industry standards (e.g., EIA-310, IPC standards) and meet customer requirements for reliability and manufacturability.

• Prototyping & Testing: Participate in the development of prototypes and coordinate with manufacturing teams for assembly and testing. Conduct thermal and mechanical testing to validate designs and optimize performance.

• Cross-Disciplinary Collaboration: Collaborate with electrical engineers and PCB designers to optimize component placement, airflow, and thermal performance. Work with manufacturing and quality assurance teams to ensure the designs are scalable and meet production standards.

Minimum Qualifications

• Bachelor’s Degree in Mechanical Engineering or a related field.
• Experience in mechanical design, preferably in electronics packaging or thermal management.

Technical Skills:

• Proficiency in CAD software (Creo, SolidWorks, or similar).
• Basic knowledge of FEA and CFD tools (ANSYS, FloTherm, or similar).
• Familiarity with thermal management techniques, especially in high-performance electronic systems.
• Knowledge of materials used in electronics packaging, such as metals, plastics, and thermal interface materials.
• Understanding liquid cooling systems or airflow management for electronics is a plus.

Soft Skills:

• Strong problem-solving and analytical skills.

• Excellent communication and teamwork skills.

• Detail-oriented with the ability to manage multiple tasks.

Preferred Qualifications

• Hands-on experience with prototype development and testing.

• Familiarity with industry standards such as EIA-310, OCP, IPC, or MIL-STD for electronics packaging.

• Basic understanding of high-performance computing systems and their specific packaging challenges.

• Experience with Python for automation, data analysis, or thermal simulations.

Location

This position is on-site. The ideal candidate must reside within commuting distance of the headquarters in the Chesterbrook Corporate Center in Wayne, PA. No relocation assistance available for this role.

Immigration Information

To qualify for this position, candidates must be located in the United States, legally authorized to work in the U.S. and must not need U.S. Visa sponsorship now or in the future.

Cornelis Networks is an equal opportunity employer, and all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity or expression, pregnancy, age, national origin, disability status, genetic information, protected veteran status, or any other characteristic protected by law.

Cornelis Networks does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services.