Lik Cheng

Lik Cheng has been working in the hardware engineering field since 1995, when they began as a Senior Hardware Engineer at Intel Corporation. In this role, they were responsible for board design, schematic capture, prototype bring up and debugging, and PCB design. In 2016, they joined cPacket Networks as a Hardware Engineer.

Lik Cheng received a BSEE in Electrical and Computer Engineering from the University of Wisconsin-Madison, followed by an MSEE in Electrical Engineering from San Diego State University.