Daniel Bell

Daniel Bell has work experience as a Mechanical Engineer at Dynex Semiconductor Ltd, starting in August 2019. Daniel'sresponsibilities include complex modeling of electrical components, product design and testing, and experimentation. Additionally, they worked as a School of Engineering Student Ambassador at the University of Lincoln from September 2015 to August 2019.

Daniel Bell has a solid education history, with a focus on mechanical engineering. Daniel first attended Sir Thomas Wharton Community College from 2008 to 2013, where they completed their GCSEs and AS Level studies. Afterward, they enrolled at The Academy at Ridgewood Trust from 2013 to 2015, completing their A-Levels in STEM subjects. Daniel then pursued their Bachelor's Degree in Mechanical Engineering at the University of Lincoln from 2015 to 2018. Building on their undergraduate studies, they further specialized in the field by completing a Master of Engineering (MEng) in Mechanical Engineering at the same university from 2018 to 2019.