Kuo-Chun Huang

Kuo-Chun Huang has a diverse work experience. From April 2016 to December 2019, they worked as a Field Service Engineer at ECI Technology, Inc, a KLA Company. From January 2020 to December 2021, they held the role of Field Application Engineer at the same company, where they performed Cu/Sn/Ni/SnAg ECP/Cobalt ECP, TSV, and by-product development. Kuo-Chun also conducted wet clean and ECP chemical metrology, ensuring customer satisfaction and resolving complex field issues. In January 2022, Kuo-Chun Huang transitioned to the role of Sr. Application Engineer at the same company, responsible for T-account plating methodology and collaborating with the R&D team on package/interconnect development projects. Kuo-Chun also engaged with new customers for chemical suppliers. Prior to that, from July 2015 to November 2015, Kuo-Chun Huang worked as a Process Engineer at HuaWei Technology Co., Ltd, and from 2014 to July 2015, they served as a substitute military service staff at the Bureau of Standard, Metrology & Inspection.

Kuo-Chun Huang obtained a Bachelor's degree in chemistry from Chung Yuan Christian University from 2008 to 2012. Following this, they pursued a Master's degree in chemistry from Kaohsiung Normal University, which they completed from 2012 to 2014.