Gabriele Lodi

Gabriele Lodi is an accomplished ASIC Designer at Eggtronic, having worked since September 2020 on the design of Mixed-Signal ASICs for power converter control, contributing to all major project phases including digital design, verification, and silicon validation. Prior to this role, Gabriele served as an R&D Electronic Engineer at Eggtronic from February 2019 to July 2020, focusing on power converter architectures and capacitive wireless data transfer technology, which was showcased at CES 2020. Gabriele's research experience includes a position as a Visiting Researcher at the University of California, Berkeley, where a custom 3D chip packaging technique for implantable neural electrodes was developed. Educational credentials include a Master of Science in Electronic Engineering from Politecnico di Torino and a Bachelor of Science in Electronic Engineering from Università degli Studi di Modena e Reggio Emilia.