Igor Loi is a Senior IC Designer at GreenWaves Technologies since September 2017, bringing extensive expertise in 3D integration technologies, Network on Chips, and ultra-low power multicore platforms. Previously, Igor served as a Post Doctoral Researcher at the Università di Bologna from January 2010 to September 2017, focusing on advanced semiconductor designs including FDSOI. Additional research experience includes visiting positions at Stanford University, where contributions were made in variability and self-repair solutions for TSV-based NoC links, and IMEC, investigating TSV processes and developing 3D test chips. Igor Loi holds a Ph.D. in Electronic Engineering from Alma Mater Studiorum – Università di Bologna and a Master's degree in Electrical, Electronics and Communications Engineering from Università degli Studi di Cagliari.
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