William Budde

William Budde is a Vice President at Hyosung Innovue Americas, working in banking strategy and solutions. With a background in managing product development and innovation within the financial industry, William has experience in branch transformation and cash automation offerings. Prior to their current role, William was a Managing Director at JPMorgan Chase & Co., overseeing terminal and security solutions. Additionally, William has held various roles in product management, technical services, and business systems analysis at different companies such as The Hartford and Accenture. William holds a Bachelor of Science degree in Industrial and Systems Engineering from The Ohio State University.