Bob Heinze

Bob Heinze currently serves as the Manager of Mechanical Engineering at Kulicke & Soffa, where responsibilities include overseeing the development of next-generation semiconductor wire bonders since January 2013. Prior experience includes a role as Senior Engineer in Hardware Engineering at Quantum, focusing on disk-based deduplication products from February 2010 to January 2013. Bob has also held various management positions in mechanical engineering at Seagate from 1997 to 2010 and Conner Peripherals from 1989 to 1995, along with serving as Project Lead for Manufacturing Equipment Design at Eastman Kodak from 1984 to May 1989. Educational qualifications include a Master of Science in Engineering Management from Santa Clara University and a Bachelor of Science in Mechanical Engineering from the University of Arizona.