Ahmer Syed

Ahmer Syed is the VP of Package Engineering at Qualcomm. Ahmer has over 20 years of experience in the semiconductor industry. Ahmer started their career at Delphi as a Sr. Engineer and then moved to Amkor Technology in 1997 where they held various positions including Sr. Director of Stacked Die Packaging and VP of Advanced Product Development/Mechanical Engineering. In September 2008, they joined Qualcomm as the VP of Package Engineering.

They are on a team with Samir Gupta - VP, Engineering, Prakash Suvarna - VP, Engineering, and Chandra Mouli - VP, Global Engineering IT. Ahmer Syed reports to Gerard Williams III, SVP, Engineering.