Jasper Büsch

Jasper Büsch has a diverse work experience. Jasper started their career in 2008 as a System Developer at REKOBA Relais- Und Fernmeldetechnik GmbH, where they developed a system to assess the frequency characteristics of loudspeakers. Jasper then joined Technische Universität Berlin as a Student Research Assistant in 2009, working on various projects, including the development of software components for the TinyOS IEEE802.15. In 2013, they became a Wissenschaftlicher Mitarbeiter am Lehrstuhl für Telekommunikationsnetzwerke at Berlin Institute of Technology, where they stayed until 2016.

In 2016, Jasper Büsch joined R3 Solutions as a Software Engineer, focused on building ultra-reliable realtime radio communication systems. Jasper progressed to roles such as Team Lead Platform and Team Lead DevOps, Testing & Tools. In 2021, they briefly served as the Head of Quality Assurance before transitioning to their current role as Chapter Lead Platform & Wireless. In this position, they lead the Wireless team, responsible for the lowest part of the technology stack on bare metal wireless chips.

Throughout their career, Jasper Büsch has demonstrated expertise in software development, quality assurance, and team leadership. Jasper has a strong background in telecommunications and has contributed to the development of innovative technologies for industrial applications and smart factories.

Jasper Büsch studied at Technische Universität Berlin from 2004 to 2013, where they obtained a Diplom degree in Technische Informatik. Jasper also holds a certification as a Diplom-Ingenieur in Technische Informatik from the same institution. However, the specific month and year of obtaining this certification are not provided.