Danyang Qiao

Danyang Qiao has a diverse work experience in the hardware design field. From 2018 to the present, Danyang worked at SK hynix memory solutions America Inc. as a Sr. Hardware Design Engineer, responsible for designing SSDs and optimizing power consumption. Prior to this role, from 2018 to 2018, Danyang worked as a Hardware Designer on contract, where they designed a system framework and selected ICs for a Bluetooth Speaker application. They also designed and tested the system, collaborating with BSP updates and OEM partners for troubleshooting. Before that, from 2013 to 2014, Danyang worked at Xiamen University as a Technical Associate and RF Research Assistant. In this role, they designed and manufactured a split-growth fractal microstrip antenna and performed simulation analysis of antenna performance.

Danyang Qiao has a Master's degree in Electrical and Electronics Engineering, which they obtained from the University of Southern California between the years 2016 and 2018. Prior to that, they completed their Bachelor's degree in the same field, specializing in Electrical and Electronics Engineering, at Xiamen University from 2011 to 2015.