Eric Wornson is a Managing Engineer at Syagrus Systems, LLC, since March 2015, where responsibilities include managing back-end semiconductor processes such as 3M wafer bond and inspection. Wornson possesses extensive experience in operations, maintenance, training, and process improvement, along with quality oversight and customer communication. Prior to this role, Wornson served as a Research Engineer at 3M, focusing on temporary adhesives for semiconductor applications. Additionally, Wornson established a small jewelry business, worked as a Research Assistant at UW Madison, an intern at Seagate Technology, and as a Lab Intern at the UW Madison Applied Superconductivity Center. Wornson holds a B.S. in Materials Science and Engineering from the University of Wisconsin-Madison, obtained in 2002.
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