Dan O'Neil

Dan O'Neil has a diverse and extensive work experience. Dan currently serves as the System Engineer and Innovation Lead at The Johns Hopkins University Applied Physics Laboratory, where they lead strategic and classified initiatives for the US government. Prior to this, Dan was the Health System Innovation Lead at The Johns Hopkins U Applied Physics Lab, providing technical leadership in healthcare systems and innovation. Dan also worked at Mayo Clinic as the Head of Project Management Office (PMO) for Radiology and as a Sr. Innovation and Communications Project Manager, where they directed innovation efforts and implemented programs for practice redesign and advanced technology. Additionally, Dan has held various managerial positions at Walt Disney World, Disneyland Paris, and Disneyland Resort, where they improved guest service and operational profits. Dan also has experience in the education sector, serving as a Board Director for Rochester Public Schools. Before that, they worked as a Manager in Information Services at Northwest Airlines. Finally, Dan has previous military experience as a Major in the US Army Corps of Engineers.

Dan O'Neil completed their education as follows:

- From 1979 to 1983, they attended the United States Military Academy at West Point, where they obtained a Bachelor of Science degree in Mathematics.

- Later, from 1991 to 1993, they studied at the Georgia Institute of Technology, earning a Master of Science degree in Industrial Engineering.

- In 1998, they attended Duke University - The Fuqua School of Business, completing a Master of Business Administration (MBA) program with a focus on Global Business Administration.

- Lastly, from 2022 to 2024, they pursued a Master's degree in Systems Engineering from The Johns Hopkins University.

Furthermore, they obtained two certifications: a Project Management Professional (PMP) certification from the Project Management Institute in 2009, and a Program Management Professional (PgMP) certification from the same institute in 2013.