William Steuerwald

William Steuerwald is an experienced Autocad Drafter currently working at Thinkpath Engineering Services since June 2023. Prior to this role, William served as a Manufacturing Engineering Intern at Merck during the summer of 2020. Additionally, William contributed as a Sophomore Advisor at Rose-Hulman Institute of Technology from September 2019 to June 2020. William holds a Bachelor of Science degree in Mechanical Engineering from Rose-Hulman Institute of Technology, completed in 2022.