Maxwell H.

Maxwell H. is a Mechanical Engineer with a Bachelor's degree in Mechanical Engineering from the University of Cincinnati. Currently employed at TPC Packaging Solutions since August 2022, Maxwell has prior experience as a Mechanical Design Engineer at QuEST Defense and completed a Mechanical Engineering Coop at PCB Piezotronics, Inc., where contributions included design revisions for pressure sensor products for high-profile clients such as Mercedes, SpaceX, and Blue Origin, along with conducting FEA analysis for design verification. Additionally, Maxwell worked as a Mechanical Engineering Coop at The Modal Shop, collaborating across disciplines with electrical engineers.