K.C. Hsu

Mr. K.C. Hsu is Vice President of Integrated Interconnect & Packaging at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), responsible for the development of TSMC’s system integration technologies, including 3D IC and advanced packaging. Prior to this role, Mr. Hsu was Taiwan Country Manager for Micron Technology, responsible for the company’s overall operations in Taiwan including two manufacturing sites. Mr. Hsu also served as President of WaferTech, TSMC’s first fab in the United States, where he successfully improved performance to reach the corporate average. He possesses more than 30 years’ experience in the semiconductor industry and has a track record of proficiency at technology transfer and optimization, yield improvement, and increasing capacity at new fabs.

Mr. K.C. Hsu received his B.S. in Physics from National Taiwan University in 1986 and his M.S. in Technology Management from National Chiao Tung University in 1994.