Jim Wu has over two decades of experience in the semiconductor industry, currently serving as a Sr. Process Integration Engineer at WaferTech since October 2000. In this role, Jim implemented TSMC automotive 2.0 systems, establishing WaferTech as a qualified automotive fab. Prior to this position, Jim worked as a Sr. Thin Film Process Engineer, focusing on CVD process improvements and collaborating with TSMC's technical board for recipe updates. Additionally, Jim has expertise in Wafer Accept Test data analysis and product yield enhancement, contributing to problem-solving and troubleshooting efforts. Jim also holds a Master’s degree in Electrical and Electronics Engineering from Oregon Health & Science University.
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