Yuen Chin Ng

Yuen Chin Ng is a seasoned engineering professional with extensive experience in semiconductor process engineering, currently serving as a Senior Field Process Engineer at ASM since November 2022, specializing in plasma-enhanced atomic layer deposition (PEALD). Prior roles include Staff Engineer at AMS Sensors Asia Pte Ltd, focusing on thin film applications for VCSEL and waveguide optics, and Senior Process Engineer at Qualcomm RFFE, where Yuen Chin successfully introduced and qualified new atomic layer deposition processes. A significant tenure at Micron Technology involved multiple positions, including Senior Engineer overseeing 3D NAND furnace steps and process optimization, yielding impressive improvements in wafer yield and production efficiency. Yuen Chin's career commenced with hands-on experience at YOKOGAWA ENGINEERING ASIA PTE LTD as an Assistant Engineer Intern, laying a strong foundation in engineering solutions and project support. Educationally, Yuen Chin holds a Bachelor's degree in Chemical Engineering from Nanyang Technological University Singapore.